At CES 2021 today, Qualcomm unveiled a new in-screen fingerprint sensor that is said to be 50% faster and 77% larger than its previous technology. The new Qualcomm 3D Sonic Sensor Gen 2 is expected to find its way to high-end Android flagships this year, and comes as Apple works to bring Touch ID back to iPhone.
As Verge reports, Qualcomm’s new 3D Sonic sensor measures 8mm x 8mm, compared to the previous generation’s 4mm x 9mm surface area. Qualcomm claims that by combining the fastest processor and the largest sensor, performance should be 50% faster with the Gen 2 than its predecessor.
The new sensor is technically Qualcomm’s third under-display ultrasonic fingerprint reader, after the original 3D Sonic Sensor and 3D Sonic Max (introduced in 2019) – which was actually just a much larger version of the first-generation sensor. , but it lacked real speed improvements. While the 3D Sonic Sensor Gen 2 doesn’t quite match the 3D Sonic Max …
- According to this source Qualcomm introduces a bigger and faster in-screen fingerprint reader, coming to smartphones this year
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